Architecture / Microarchitecture
Microarchitecture : Kaby lake
Processor core : Kaby lake-S
Manufacturing process:
0.014 micron
Data width : 64 bit
The number of CPU cores : 4
The number of threads : 4
Level 2 cache size : 4 x 256 KB 8-way set associative caches
Level 3 cache size : 6MB 12-way set associative shared cache
Multiprocessing Uniprocessor
Integrated peripherals / Components
Display controller 3 displays
Integrated graphics
GPU Type: HD 630
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 1000
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Maximum operating temperature 100°C
Thermal Design Power 65 Watt
